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Micro-hole glass (TGV)
---->Enables 2.5 and 3D packaging.


Micro-hole glass
Micro-hole glass (TGV)

Able to provide ultra-thin and high-strength TGV substrates up to 730 x 920mm size.

NSC's unique glass hole formation technology realizes fine through hole processing (Through Glass Vias) and provides glass substrate materials for glass interposer that enables 2.5 and 3D packaging. Also combined with the unique chemical etching (slimming) processing technology (minimum plate thickness 50 μm), which was cultivated to meet the demand for thinner and stronger LCD panels, as well as the chemical cutting that does not generate micro cracks on the glass edge, NSC is able to provide ultra-thin and high-strength TGV substrates. Glass is proven in alkali-free glass, alkali glass and quartz glass. The hole diameter range is basically φ20μm to φ200μm.

Micro-hole glass

Features of the Micro-hole (TGV) Process

Strength

Comparing with ordinal machanical drilling method, because it processes with melting glass with chemicals, micro cracks (a tiny invisible scratch normally formed by mechanical grinding) could not be occurred. Thus high glass strength can be aquired.

Efficiency

Besides making of micro-hole (TGV), both slimming down the glass thickness (ultra-thin slimming) and chemical cutting into the required final chip size can be performed by our production line.

Available specification
Glass material Alkali-free glass , Alkali glass (Sodalime glass)
Size Min 120mm x 120mm , Max 730mm x 920mm
Sheet thickness Min 0.05mmt~Max0.9mmt
Hole type Through Via(True circle or Ellipse), Blind Via(True circle or Ellipse)
Hole shape Hourglass
Hole diameter φ20μm~φ200μm
*Hole diameter is based on surface diameter.
* There is a thickness limitation.
Option Singulation from hole-processed large-sized glass.
Chemical cut method

TGV_Proceess_able

Uses and Applications, Specific Examples

Application example
    -2.5 and 3D Implementation package
  • The miniaturization of semiconductors, which has driven the speeding up of large scale integrated circuits, has reached a limit. Circuit board miniaturization is also stagnant. Micro-hole glass has potential to make 3D implementation package.

3D implementation package with micro-hole glass